Invention Grant
- Patent Title: Liquid epoxy resin composition and semiconductor device
- Patent Title (中): 液体环氧树脂组合物和半导体器件
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Application No.: US11386776Application Date: 2006-03-23
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Publication No.: US07692318B2Publication Date: 2010-04-06
- Inventor: Hiroyuki Takenaka
- Applicant: Hiroyuki Takenaka
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2005-087669 20050325
- Main IPC: H01L23/29
- IPC: H01L23/29 ; C08L63/00 ; B32B27/04 ; B32B27/18 ; B32B27/20 ; B32B27/26 ; B32B27/38
Abstract:
Better semiconductor encapsulation is achieved with a liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent containing at least 5 wt % of an aromatic amine compound, (C) a microencapsulated catalyst containing a phenolic hydroxy-bearing benzoic acid derivative, and optionally, (D) an inorganic filler.
Public/Granted literature
- US20060217499A1 Liquid epoxy resin composition and semiconductor device Public/Granted day:2006-09-28
Information query
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