Invention Grant
US07692435B2 Probe card and probe device for inspection of a semiconductor device
失效
用于半导体器件检测的探针卡和探针装置
- Patent Title: Probe card and probe device for inspection of a semiconductor device
- Patent Title (中): 用于半导体器件检测的探针卡和探针装置
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Application No.: US11701379Application Date: 2007-02-02
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Publication No.: US07692435B2Publication Date: 2010-04-06
- Inventor: Shigekazu Komatsu , Takashi Amemiya , Jun Mochizuki
- Applicant: Shigekazu Komatsu , Takashi Amemiya , Jun Mochizuki
- Applicant Address: JP
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Main IPC: G01R31/02
- IPC: G01R31/02
Abstract:
The probe card is configured such that the outline of the probe card is formed almost round shape and a plurality of connectors for being electrically connected with a tester are provided on the upper surface thereof along the outline. A substrate with many probes arranged thereon is provided on the bottom surface of the probe card. The substrate and the connectors are connected with one another via a flexible print wiring board.
Public/Granted literature
- US20070182431A1 Probe card and probe device Public/Granted day:2007-08-09
Information query
