Invention Grant
- Patent Title: Temperature compensating circuit
- Patent Title (中): 温度补偿电路
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Application No.: US11846417Application Date: 2007-08-28
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Publication No.: US07692476B2Publication Date: 2010-04-06
- Inventor: Ryoichi Anzai
- Applicant: Ryoichi Anzai
- Applicant Address: JP Chiba
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP Chiba
- Agency: Brinks Hofer Gilson & Lione
- Priority: JP2006-232194 20060829
- Main IPC: H03K3/42
- IPC: H03K3/42

Abstract:
Provided is a temperature compensating circuit, which conducts a temperature correction having a continuous characteristic, and is small in the circuit scale. An output voltage VOUT at a connection point 14 is determined on the basis of a current Ia2, a current Ib2, and a current Ic2, and an output voltage of a temperature sensor circuit is corrected by the output voltage VOUT with a temperature. As a result, the temperature correction having the continuous characteristic is conducted on the basis of a current change of the current Ia2, the current Ib2, and the current Ic2. Because the plural temperature compensating circuits are not provided, and only one temperature compensating circuit is provided, the circuit scale becomes smaller.
Public/Granted literature
- US20080054871A1 TEMPERATURE COMPENSATING CIRCUIT Public/Granted day:2008-03-06
Information query
IPC分类: