Invention Grant
- Patent Title: Acoustic surface wave filter module and method of manufacturing the same
- Patent Title (中): 声表面波滤波器模块及其制造方法
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Application No.: US12462385Application Date: 2009-08-03
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Publication No.: US07692513B2Publication Date: 2010-04-06
- Inventor: Susumu Yoshimoto
- Applicant: Susumu Yoshimoto
- Applicant Address: JP Tokyo
- Assignee: Nihon Dempa Kogyo Co., Ltd.
- Current Assignee: Nihon Dempa Kogyo Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Jordan and Hamburg LLP
- Priority: JP2005-236933 20050817
- Main IPC: H03H7/38
- IPC: H03H7/38 ; H01L41/00 ; H03H9/00

Abstract:
In order to reduce the parts required for matching of an SAW filter module, the SAW filter module 10 obtains matching for coupling SAW filters 10A to 10D with RF-IC 20 using impedance matching circuits 11A to 11D. The real part of output impedance Z saw of the SAW filter is closely matched with the real part of input impedance Zic of an RF-IC. The impedance matching circuit modifies the imaginary part of the output impedance Zm of the SAW filter module according to the imaginary part of the input impedance Zic of the RF-IC 20. The impedance matching circuit composed of one piece of inductance or capacitor, or a plurality of inductors or capacitors in parallel connection, ans formed as a print pattern on a module substrate, in which the real part R saw and the real part Ric are in a relation nearly of 0.8 Ric
Public/Granted literature
- US20090318108A1 Acoustic surface wave filter module and method of manufacturing the same Public/Granted day:2009-12-24
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