A radio-frequency integrated circuit chip package with at least one integrated aperture-coupled patch antenna includes at least one generally planar patch and at least one generally planar ground plane spaced inwardly from the generally planar patch and substantially parallel thereto. The ground plane is formed with at least one coupling aperture slot therein. The slot is substantially opposed to the patch. Also included are at least one feed line spaced inwardly from the ground plane and substantially parallel thereto, at least one radio frequency chip spaced inwardly from the feed line and coupled to the feed line and the ground plane, and a first substrate layer spaced inwardly from the feed line. The first substrate layer is formed with a chip-receiving cavity. The chip is located in the chip-receiving cavity.