Invention Grant
US07692769B2 Exposure apparatus, exposure method, and semiconductor device manufacturing method
失效
曝光装置,曝光方法以及半导体装置的制造方法
- Patent Title: Exposure apparatus, exposure method, and semiconductor device manufacturing method
- Patent Title (中): 曝光装置,曝光方法以及半导体装置的制造方法
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Application No.: US11543082Application Date: 2006-10-05
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Publication No.: US07692769B2Publication Date: 2010-04-06
- Inventor: Kazuya Fukuhara , Takashi Sato
- Applicant: Kazuya Fukuhara , Takashi Sato
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2005-294689 20051007
- Main IPC: G03B27/54
- IPC: G03B27/54 ; G03B27/72

Abstract:
According to an aspect of the invention, there is provided an exposure apparatus including an illumination optical system which forms an effective light source having a first polarization area where a mask pattern is illuminated with polarized light dominated by an electric vector component radial from a center position on an effective light source plane, and a second polarization area where the mask pattern is illuminated with light whose electric vector vibration is not biased in a specific direction; and a projection optical system which projects an image of the mask pattern onto an object to be processed.
Public/Granted literature
- US20070081139A1 Exposure apparatus, exposure method, and semiconductor device manufacturing method Public/Granted day:2007-04-12
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