Invention Grant
- Patent Title: Hermetically sealed head disk assembly and method of sealing with soldering material
- Patent Title (中): 密封头盘组件和焊接材料密封方法
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Application No.: US11352101Application Date: 2006-02-09
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Publication No.: US07692891B2Publication Date: 2010-04-06
- Inventor: Michael R. Hatchett , Kirk Price
- Applicant: Michael R. Hatchett , Kirk Price
- Applicant Address: NL Amsterdam
- Assignee: Hitachi Global Storage Technologies Netherlands B.V.
- Current Assignee: Hitachi Global Storage Technologies Netherlands B.V.
- Current Assignee Address: NL Amsterdam
- Main IPC: G11B33/14
- IPC: G11B33/14
Abstract:
A sealed head disk assembly has a cover for enclosing major components of the head disk assembly. The cover has a hermetic seal encompassing an outer perimeter of the cover and a semi-hermetic seal inside a perimeter of the hermetic seal. The hermetic seal and semi-hermetic seal are juxtaposed to at least one complementary surface on the base casting. The base casting, which provides attachment points for the major components of the head disk assembly has at least one complementary surface.
Public/Granted literature
- US20070183088A1 Hermetically sealed head disk assembly and method of sealing with soldering material Public/Granted day:2007-08-09
Information query
IPC分类:
