Invention Grant
- Patent Title: Head suspension having wiring disposed in contact with slightly conductive flexible resin
- Patent Title (中): 头部悬挂具有布置成与导电柔性树脂接触的布线
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Application No.: US11359981Application Date: 2006-02-21
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Publication No.: US07692899B2Publication Date: 2010-04-06
- Inventor: Hajime Arai , Ikuo Someya , Ryuichi Kawatake , Tsukasa Higashi
- Applicant: Hajime Arai , Ikuo Someya , Ryuichi Kawatake , Tsukasa Higashi
- Applicant Address: JP Yokohama
- Assignee: NHK Spring Co., Ltd.
- Current Assignee: NHK Spring Co., Ltd.
- Current Assignee Address: JP Yokohama
- Agency: Jordan and Hamburg LLP
- Priority: JP2005-044753 20050221; JP2005-189800 20050629
- Main IPC: G11B21/16
- IPC: G11B21/16 ; G11B5/48

Abstract:
A head suspension prevents a read element from electrostatic discharge damage without employing a static electricity remover or without increasing the number of manufacturing processes. The head suspension has a load beam to apply load to a head that writes and reads data to and from a hard disk, a flexure made of a conductive thin substrate attached to the load beam and supporting the head, an insulating base layer made of flexible resin and formed on the substrate of the flexure, write wires and read wires connected to the head and formed on the insulating base layer, and an insulating cover layer covering the write and read wires on the insulating base layer. The insulating cover layer is made of slightly conductive flexible resin.
Public/Granted literature
- US20060190673A1 Head suspension Public/Granted day:2006-08-24
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