Invention Grant
US07692922B2 Heatsink, method of manufacturing same, and microelectronic package containing same
有权
散热器，其制造方法以及含有其的微电子封装
- Patent Title: Heatsink, method of manufacturing same, and microelectronic package containing same
- Patent Title (中): 散热器，其制造方法以及含有其的微电子封装
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Application No.: US11772144Application Date: 2007-06-30
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Publication No.: US07692922B2Publication Date: 2010-04-06
- Inventor: Javier Leija , Ioan Sauciuc , Steve Frayne, Jr.
- Applicant: Javier Leija , Ioan Sauciuc , Steve Frayne, Jr.
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent Kenneth A. Nelson
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A heatsink comprises a base (110, 210, 310), a fin (120, 220, 320) attached to the base, and a piezoelectric patch (130, 230, 330) attached to the fin. The piezoelectric patch causes the fin to oscillate, thus generating air circulation near the fin surface. This airflow disturbs the boundary layer near the fin and dramatically increases the heat transfer from the fin to air compared to a non-oscillating fin, even for the same bulk flow rate.
Public/Granted literature
- US20090034197A1 HEATSINK, METHOD OF MANUFACTURING SAME, AND MICROELECTRONIC PACKAGE CONTAINING SAME Public/Granted day:2009-02-05
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