Invention Grant
- Patent Title: Resilient grounding clip in electronics chassis
- Patent Title (中): 电子机箱中的弹性接地夹
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Application No.: US11687447Application Date: 2007-03-16
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Publication No.: US07692932B2Publication Date: 2010-04-06
- Inventor: Steve Bisbikis , Steve Koo , Todd Collis
- Applicant: Steve Bisbikis , Steve Koo , Todd Collis
- Applicant Address: US CO Broomfield
- Assignee: Flextronics AP, LLC
- Current Assignee: Flextronics AP, LLC
- Current Assignee Address: US CO Broomfield
- Agency: Marsh Fischmann & Breyfogle, LLP
- Agent Robert G. Crouch
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
The devices and methods herein provide ground for computer cards inserted into a computer card chassis (e.g., VME chassis, CompactPCI chassis, ATCA chassis, etc.). A resilient clip may be configured with a chassis member of the computer card chassis. The clip is affixed to the computer card chassis and maintains contact with a ground plane, such as an ESD shield. The clip may have a self locking mechanism which insurers that the clip resides at a fixed position with the chassis member. A computer card may then be inserted into the computer card chassis and thereby make contact with the resilient clip. The computer card may include a ground pin which inserts through an aperture within the chassis member to make contact with the resilient clip. Accordingly, the inserted computer card may be provided with ESD protection as well as a ground reference potential from the computer card chassis.
Public/Granted literature
- US20070217172A1 RESILIENT GROUNDING CLIP IN ELECTRONICS CHASSIS Public/Granted day:2007-09-20
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