Invention Grant
US07692946B2 Memory array on more than one die 有权
内存阵列在多个模具上

Memory array on more than one die
Abstract:
For one disclosed embodiment, an apparatus may comprise a first die including a first plurality of memory cells for a memory array and a second die including a second plurality of memory cells for the memory array. The second die may include a shared line for the memory array to conduct digital signals for memory cells of both the first and second plurality of memory cells. Other embodiments are also disclosed.
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