Invention Grant
- Patent Title: Memory array on more than one die
- Patent Title (中): 内存阵列在多个模具上
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Application No.: US11771054Application Date: 2007-06-29
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Publication No.: US07692946B2Publication Date: 2010-04-06
- Inventor: Mohammed H. Taufique , Derwin Jallice , Donald W. McCauley , John P. DeVale , Edward A. Brekelbaum , Jeffrey P. Rupley, II , Gabriel H. Loh , Bryan Black
- Applicant: Mohammed H. Taufique , Derwin Jallice , Donald W. McCauley , John P. DeVale , Edward A. Brekelbaum , Jeffrey P. Rupley, II , Gabriel H. Loh , Bryan Black
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent Matthew C. Fagan
- Main IPC: G11C5/06
- IPC: G11C5/06

Abstract:
For one disclosed embodiment, an apparatus may comprise a first die including a first plurality of memory cells for a memory array and a second die including a second plurality of memory cells for the memory array. The second die may include a shared line for the memory array to conduct digital signals for memory cells of both the first and second plurality of memory cells. Other embodiments are also disclosed.
Public/Granted literature
- US20090001601A1 MEMORY ARRAY ON MORE THAN ONE DIE Public/Granted day:2009-01-01
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