Invention Grant
US07693068B2 Systems, methods, and computer program products for providing a distributed hardware platform interface (HPI) architecture
有权
用于提供分布式硬件平台接口(HPI)架构的系统,方法和计算机程序产品
- Patent Title: Systems, methods, and computer program products for providing a distributed hardware platform interface (HPI) architecture
- Patent Title (中): 用于提供分布式硬件平台接口(HPI)架构的系统,方法和计算机程序产品
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Application No.: US11594013Application Date: 2006-11-07
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Publication No.: US07693068B2Publication Date: 2010-04-06
- Inventor: Steven M. Freedman , Laurie J. Blackburn , Michael J. Wands , Huyen L. Nguyen , Robert J. Tomasko , Robert K. Bubnis , Andrew A. Joslin , John A. Crosson
- Applicant: Steven M. Freedman , Laurie J. Blackburn , Michael J. Wands , Huyen L. Nguyen , Robert J. Tomasko , Robert K. Bubnis , Andrew A. Joslin , John A. Crosson
- Applicant Address: US NC Morrisville
- Assignee: Tekelec
- Current Assignee: Tekelec
- Current Assignee Address: US NC Morrisville
- Agency: Jenkins, Wilson, Taylor & Hunt, P.A.
- Main IPC: H04L12/26
- IPC: H04L12/26

Abstract:
Systems, methods, and computer program products for providing a distributed hardware platform interface (HPI) architecture are disclosed. According to one aspect, the subject matter described herein includes a system for providing distributed operations, administration, and maintenance (OAM) functionality in a multi-shelf processing environment. The system includes a first shelf that includes first hardware components, a second shelf that includes second hardware components, and an OAM module for providing an OAM function. The system also includes a first hardware platform interface (HPI) daemon for communicating OAM-related information between the first hardware components and the OAM module, and a second HPI daemon for communicating OAM-related information between the second hardware components and the OAM module.
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