Invention Grant
US07693382B2 Substrate for mounting IC chip, multilayered printed circuit board, and device for optical communication
有权
用于安装IC芯片的基板，多层印刷电路板和用于光通信的装置
- Patent Title: Substrate for mounting IC chip, multilayered printed circuit board, and device for optical communication
- Patent Title (中): 用于安装IC芯片的基板，多层印刷电路板和用于光通信的装置
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Application No.: US11101566Application Date: 2005-04-08
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Publication No.: US07693382B2Publication Date: 2010-04-06
- Inventor: Motoo Asai
- Applicant: Motoo Asai
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: G02B6/10
- IPC: G02B6/10
Abstract:
A device for optical communication includes an organic optical waveguide having a core part and a cladding part. The core part and the cladding part comprise a polymer material, and the cladding part includes particles.
Public/Granted literature
- US20050185880A1 Substrate for mounting IC chip, multilayered printed circuit board, and device for optical communication Public/Granted day:2005-08-25
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