Methods and apparatuses to measure temperatures of integrated circuits are disclosed. New circuit arrangements for measuring temperature using various types of integrated circuit sensor elements are discussed. Embodiments comprise methods and apparatuses arranged to measure temperature based upon current leakage rates of different integrated circuit sensor elements. The methods and apparatuses generally involve using a pulse module to generate a charge for the integrated circuit elements. In these method and apparatus embodiments, one or more elements form a decay module to sense when the voltage decays to a threshold value. The method and apparatus embodiments may also have a module to calculate or infer a temperature from the rate of the voltage decay.