Invention Grant
- Patent Title: Method of manufacturing multilayered electronic component
- Patent Title (中): 制造多层电子部件的方法
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Application No.: US12099213Application Date: 2008-04-08
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Publication No.: US07694414B2Publication Date: 2010-04-13
- Inventor: Tomoyuki Maeda , Hideaki Matsushima
- Applicant: Tomoyuki Maeda , Hideaki Matsushima
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2003-407266 20031205
- Main IPC: H05K3/30
- IPC: H05K3/30

Abstract:
A multilayered electronic component that is easy to manufacture and that has excellent electrical characteristics includes end portions of coil wiring patterns that oppose a coil connection electrode that is displaced on the surface of a second ceramic layer due to an increase or decrease in the number of first ceramic layers. A coil connection electrode has a shape in which surface portions of second ceramic layers or opposed second ceramic layers having the first ceramic layers disposed in between are connected to the end portions of the coil wiring patterns that oppose the respective coil connection electrode, which are displaced due to the increase or decrease in the number of the first ceramic layers. A connection wiring pattern has a shape in which one portion of a coil connection electrode is connected to one portion of an external extension electrode connection pattern.
Public/Granted literature
- US20080250628A1 METHOD OF MANUFACTURING MULTILAYERED ELECTRONIC COMPONENT AND MULTILAYERED ELECTRONIC COMPONENT Public/Granted day:2008-10-16
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