Invention Grant
- Patent Title: Method and apparatus for wafer-level micro-glass-blowing
- Patent Title (中): 用于晶圆级微玻璃吹制的方法和装置
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Application No.: US11526436Application Date: 2006-09-25
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Publication No.: US07694531B2Publication Date: 2010-04-13
- Inventor: E. Jesper Eklund , Andrei M. Shkel
- Applicant: E. Jesper Eklund , Andrei M. Shkel
- Applicant Address: US CA Oakland
- Assignee: The Regents of the University of California
- Current Assignee: The Regents of the University of California
- Current Assignee Address: US CA Oakland
- Agent Daniel L. Dawes; Marcus C. Dawes
- Main IPC: C03B19/10
- IPC: C03B19/10 ; B29D22/00 ; B29D22/04

Abstract:
A method for forming microspheres on a microscopic level comprises the steps of defining holes through a substrate, disposing a sheet of thermally formable material onto the substrate covering the holes, heating the sheet of thermally formable material until a predetermined degree of plasticity is achieved, applying fluidic pressure through the holes to the sheet of thermally formable material, while the sheet of glass is still plastic, and forming microspheres on the substrate in the sheet of thermally formable material by means of continued application of pressure for a predetermined time. The invention also includes a substrate having a plurality of holes defined therethrough, a layer of thermally formable material disposed onto the substrate covering the plurality of holes, and a plurality of microspheres thermally formed in the layer by means of applied pressure through the holes when it has been heated to a predetermined degree of plasticity.
Public/Granted literature
- US20070071922A1 Method and apparatus for wafer-level micro-glass-blowing Public/Granted day:2007-03-29
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