Invention Grant
- Patent Title: Folding system
- Patent Title (中): 折叠系统
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Application No.: US12111857Application Date: 2008-04-29
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Publication No.: US07694543B2Publication Date: 2010-04-13
- Inventor: Byung-Jun Song
- Applicant: Byung-Jun Song
- Applicant Address: KR Anyang US CA San Diego
- Assignee: Seoul Laser Dieboard System Co.,Seoul Laser Dieboard System Co.
- Current Assignee: Seoul Laser Dieboard System Co.,Seoul Laser Dieboard System Co.
- Current Assignee Address: KR Anyang US CA San Diego
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- Agent Samuel S. Lee
- Priority: KR95-16975 19950622
- Main IPC: B21D11/00
- IPC: B21D11/00

Abstract:
A system for folding a ribbon stock, the system including: a transferring unit; a guide member having a passage for guiding the ribbon stock, the passage defining a longitudinal axis; a folding means supported to revolve and move in a direction substantially transverse to the longitudinal axis for applying a force against the ribbon stock passing through the guide member; a driving means; a supporting frame; a fixing body having a predetermined length and a guide entrance operatively connected with the guide member, wherein ends of the fixing body are rotatably fixed to the supporting frame, the fixing body having a guide slot formed therein for insertably receiving the folding means; and a pair of rotary bodies rotatably connected to the ends of the fixing body for revolving the folding means, the pair of rotary bodies configured to insertably receive the folding means.
Public/Granted literature
- US20080202188A1 FOLDING SYSTEM Public/Granted day:2008-08-28
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