Invention Grant
- Patent Title: Heat sink with heat pipes
- Patent Title (中): 带热管的散热器
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Application No.: US11309811Application Date: 2006-10-02
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Publication No.: US07694718B2Publication Date: 2010-04-13
- Inventor: Cheng-Tien Lai , Zhi-Yong Zhou , Yi-San Liu
- Applicant: Cheng-Tien Lai , Zhi-Yong Zhou , Yi-San Liu
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agent Frank R. Niranjan
- Main IPC: F28D15/00
- IPC: F28D15/00 ; H05K7/20
Abstract:
A heat sink includes a first plate having a top portion and a bottom portion, a second plate projecting from the top portion of the first plate, and a plurality of fins thermally contacting the second plate. The second plate has a width larger than that of the first plate. The heat pipe includes a first portion embedded in the bottom portion of the first plate for directly contacting an electronic component to be cooled, and a second portion bent from one end of the first portion. The second portion is located at one side of the first plate, while the first portion of the heat pipe is located at a middle of the first plate.
Public/Granted literature
- US20080078528A1 HEAT SINK WITH HEAT PIPES Public/Granted day:2008-04-03
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