Invention Grant
- Patent Title: Slotted substrates and methods and systems for forming same
- Patent Title (中): 开槽衬底及其形成方法和系统
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Application No.: US11410358Application Date: 2006-04-25
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Publication No.: US07695104B2Publication Date: 2010-04-13
- Inventor: Jeremy Donaldson , Eric L. Nikkel , Jeffrey S. Obert , Jeffrey R. Pollard , Jeff Hess
- Applicant: Jeremy Donaldson , Eric L. Nikkel , Jeffrey S. Obert , Jeffrey R. Pollard , Jeff Hess
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: B41J2/135
- IPC: B41J2/135
Abstract:
Methods and systems for forming compound slots in a substrate are described. In one exemplary implementation, a structure contains a plurality of slots in a substrate. The structure also has a trench in the substrate contiguous with the plurality of slots to form a compound slot.
Public/Granted literature
- US20060192815A1 Slotted substrates and methods and systems for forming same Public/Granted day:2006-08-31
Information query
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