Invention Grant
- Patent Title: Liquid ejecting apparatus
- Patent Title (中): 液体喷射装置
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Application No.: US11872848Application Date: 2007-10-16
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Publication No.: US07695115B2Publication Date: 2010-04-13
- Inventor: Fujio Akahane
- Applicant: Fujio Akahane
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2006-283519 20061018
- Main IPC: B41J2/45
- IPC: B41J2/45

Abstract:
A liquid ejecting apparatus comprising a plurality of liquid ejecting heads, each of the liquid ejecting heads including: a liquid introduction pressure adjusting member which is connected to a liquid passage member communicating with a liquid storing member for storing the liquid, the liquid introduction pressure adjusting member being supplied with a liquid from the liquid passage member and introducing the liquid to a side of a pressure chamber; a nozzle array in which a plurality of nozzle holes are arrayed in a line, the nozzle holes ejecting, as liquid droplets by an operation of a pressure generating unit, the liquid introduced from the liquid introduction pressure adjusting member to the pressure chamber; and a driving board for relaying a driving signal to the pressure generating unit and which has a wire connection portion on a sidewall of the liquid ejection head, the wire connecting portion connecting to a wire member for supplying the driving signal. The liquid introduction pressure adjusting member is disposed on an opposite side to a nozzle hole formation surface. The liquid passage member is arranged along the nozzle array on a surface of a side of the liquid introduction pressure adjusting member opposite the nozzle hole formation surface of the liquid ejecting head. The liquid ejecting heads are arranged such that the nozzle hole formation surfaces are arranged in the same plane and the nozzle arrays are parallel to each other.
Public/Granted literature
- US20080165224A1 LIQUID EJECTING APPARATUS Public/Granted day:2008-07-10
Information query
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