Invention Grant
- Patent Title: System to calibrate on-die temperature sensor
- Patent Title (中): 系统校准模块温度传感器
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Application No.: US12178884Application Date: 2008-07-24
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Publication No.: US07695189B2Publication Date: 2010-04-13
- Inventor: Chee H. Lim , Jed D. Griffin , Kifah M. Muraweh
- Applicant: Chee H. Lim , Jed D. Griffin , Kifah M. Muraweh
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Buckley, Maschoff & Talwalkar LLC
- Main IPC: G01K7/01
- IPC: G01K7/01

Abstract:
A system may include biasing of diodes of a temperature sensor disposed in an integrated circuit die using a current from an off-die current source, generation of a voltage based on the current and a temperature of the integrated circuit die, and determination of a first temperature based on the voltage. Such a system may further include amplification of the voltage using an oscillator and a chopper stabilizer, determination of a first amplified voltage associated with a first state of the oscillator and a second amplified voltage associated with a second state of the oscillator, and determination of a third voltage based on the first amplified voltage and the second amplified voltage, wherein determination of the first temperature based on the voltage comprises determination of the first temperature based on the third voltage.
Public/Granted literature
- US20080304546A1 SYSTEM TO CALIBRATE ON-DIE TEMPERATURE SENSOR Public/Granted day:2008-12-11
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