Invention Grant
- Patent Title: Substrate processing apparatus
- Patent Title (中): 基板加工装置
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Application No.: US11477931Application Date: 2006-06-30
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Publication No.: US07695233B2Publication Date: 2010-04-13
- Inventor: Masato Toshima
- Applicant: Masato Toshima
- Applicant Address: US CA San Jose
- Assignee: Orbotech LT Solar, LLC.
- Current Assignee: Orbotech LT Solar, LLC.
- Current Assignee Address: US CA San Jose
- Agency: Nixon Peabody LLP
- Agent Joseph Bach
- Priority: JP2006-058769 20060304
- Main IPC: C23F1/08
- IPC: C23F1/08

Abstract:
The substrate processing apparatus is capable of highly efficiently feeding and carrying out work and improving production efficiency. The substrate processing apparatus comprises: a processing chamber including a processing stage; a first load lock chamber for feeding the work, the first load lock chamber being communicated to the processing chamber; a second load lock chamber for carrying out the work, the second load lock chamber being communicated to the processing chamber; a first buffer storage being located between the processing chamber and the first load lock chamber, the first buffer storage storing the work to be transferred therebetween; and a second buffer storage being located between the processing chamber and the second load lock chamber, the second buffer storage storing the work to be transferred therebetween.
Public/Granted literature
- US20070207014A1 Substrate processing apparatus Public/Granted day:2007-09-06
Information query
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