Invention Grant
- Patent Title: Downstream plasma shielded film cooling
- Patent Title (中): 下游等离子屏蔽膜冷却
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Application No.: US11606853Application Date: 2006-11-30
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Publication No.: US07695241B2Publication Date: 2010-04-13
- Inventor: Ching-Pang Lee , Aspi Rustom Wadia , David Glenn Cherry , Je-Chin Han
- Applicant: Ching-Pang Lee , Aspi Rustom Wadia , David Glenn Cherry , Je-Chin Han
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agent William Scott Andes; Steven J. Rosen
- Main IPC: F01D5/18
- IPC: F01D5/18 ; F01D25/12 ; F04D29/58

Abstract:
An downstream plasma boundary layer shielding system includes film cooling apertures disposed through a wall having cold and hot surfaces and angled in a downstream direction from a cold surface of the wall to an outer hot surface of the wall. A plasma generator located downstream of the film cooling apertures is used for producing a plasma extending downstream over the film cooling apertures. Each plasma generator includes inner and outer electrodes separated by a dielectric material disposed within a groove in the outer hot surface. The wall may be part of a hollow airfoil or an annular combustor or exhaust liner. A method for operating the downstream plasma boundary layer shielding system includes forming a plasma extending in the downstream direction over the film cooling apertures along the outer hot surface of the wall. The method may further include operating the plasma generator in steady state or unsteady modes.
Public/Granted literature
- US20080131265A1 Downstream plasma shielded film cooling Public/Granted day:2008-06-05
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