Invention Grant
- Patent Title: Molding structure
- Patent Title (中): 成型结构
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Application No.: US11555913Application Date: 2006-11-02
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Publication No.: US07695266B2Publication Date: 2010-04-13
- Inventor: Jeffrey Douglas MacDonald , Adam Craig Reynolds , Paul Michael Swenson , John Nicholas Kermet
- Applicant: Jeffrey Douglas MacDonald , Adam Craig Reynolds , Paul Michael Swenson , John Nicholas Kermet
- Applicant Address: CA Bolton, ON
- Assignee: Husky Injection Molding Systems Ltd.
- Current Assignee: Husky Injection Molding Systems Ltd.
- Current Assignee Address: CA Bolton, ON
- Main IPC: B29C45/10
- IPC: B29C45/10 ; B29C45/16
Abstract:
Disclosed is a molding structure, amongst other things.
Public/Granted literature
- US20080107764A1 Molding Structure and a Method of Molding Public/Granted day:2008-05-08
Information query
