Invention Grant
- Patent Title: Board connector
- Patent Title (中): 板连接器
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Application No.: US11887790Application Date: 2006-04-21
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Publication No.: US07695290B2Publication Date: 2010-04-13
- Inventor: Hiroshi Nakano , Masahide Hio , Kenji Okamura , Hiroki Hirai , Hiroomi Hiramitsu , Osamu Hirabayashi
- Applicant: Hiroshi Nakano , Masahide Hio , Kenji Okamura , Hiroki Hirai , Hiroomi Hiramitsu , Osamu Hirabayashi
- Applicant Address: JP JP JP
- Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electronic Industries, Ltd.
- Current Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electronic Industries, Ltd.
- Current Assignee Address: JP JP JP
- Agent Gerald E. Hespos; Anthony J. Casella
- Priority: JP2005-125416 20050422
- International Application: PCT/JP2006/308455 WO 20060421
- International Announcement: WO2006/115218 WO 20061102
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A board connector (1) has a housing (10) and terminal fittings (20) penetrate through the back wall (11) of the housing (10). A board connecting portion (21) of each terminal fitting (20) penetrates through the back wall (11) and is solder-connected to a board (2). The housing (10) has a heat transfer inhibiting portion for inhibiting heat transfer to the back wall (11). The heat transfer inhibiting portion has a through-hole (13) or heat-insulating grooves (17) in the back wall (11). As a result, heat transfer to the back wall (11) is inhibited and deformation of the back wall (11) due to thermal expansion also is inhibited. Consequently, it is possible to prevent the terminal fittings (20) from separating from the board (2) and going into a state of being not solder-connected thereto.
Public/Granted literature
- US20090029574A1 Board Connector Public/Granted day:2009-01-29
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