Invention Grant
- Patent Title: Hinged module coupling with integrated cable connection
- Patent Title (中): 铰链模块耦合，集成电缆连接
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Application No.: US11380703Application Date: 2006-04-28
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Publication No.: US07695298B2Publication Date: 2010-04-13
- Inventor: Andrew E. Arndt , Ronald E. Dillon
- Applicant: Andrew E. Arndt , Ronald E. Dillon
- Applicant Address: US CT Norwalk
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: US CT Norwalk
- Agency: Marger Johnson & McCollom, P.C.
- Main IPC: H01R3/00
- IPC: H01R3/00
Abstract:
A hinge includes a first housing, a second housing mechanically coupled to the first housing, a cam connected to one of the first housing and the second housing, a first connector mechanically coupled to the first housing, a second connector, and a cable coupled to the first connector and the second connector.
Public/Granted literature
- US20070254495A1 HINGED MODULE COUPLING WITH INTEGRATED CABLE CONNECTION Public/Granted day:2007-11-01
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