Invention Grant
- Patent Title: Electrically insulated conductor connection assemblies and associated method
- Patent Title (中): 电绝缘导体连接组件及相关方法
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Application No.: US11689810Application Date: 2007-03-22
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Publication No.: US07695300B2Publication Date: 2010-04-13
- Inventor: Brad R. Leccia , Adri Lammers , Francois Marchand , Paul Schoten , Marcel Van Dijk , Gerard Schoonenberg , Johannes Josephus Gerardus Van Thiel
- Applicant: Brad R. Leccia , Adri Lammers , Francois Marchand , Paul Schoten , Marcel Van Dijk , Gerard Schoonenberg , Johannes Josephus Gerardus Van Thiel
- Applicant Address: US OH Cleveland
- Assignee: Eaton Corporation
- Current Assignee: Eaton Corporation
- Current Assignee Address: US OH Cleveland
- Agent Martin J. Moran
- Main IPC: H01R13/15
- IPC: H01R13/15

Abstract:
An electrically insulated conductor connection assembly and a method for providing the same are provided. The electrically insulated conductor connection assembly includes first and second electrical conductors each comprising a body portion and an end portion. A fastening mechanism electrically and mechanically connects the end portions of the first electrical conductor to the end portion of the second electrical conductor, and an insulator overlays and electrically insulates the fastening mechanism. The end portions of the first and second electrical conductors and the fastening mechanism form a joint, which is structured to be fastenable and unfastenable. When the joint is fastened and the insulator is overlaying the fastening mechanism, the joint is electrically insulated.
Public/Granted literature
- US20080230359A1 ELECTRICALLY INSULATED CONDUCTOR CONNECTION ASSEMBLIES AND ASSOCIATED METHOD Public/Granted day:2008-09-25
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