Invention Grant
- Patent Title: Electronic part-connecting structure
- Patent Title (中): 电子部件连接结构
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Application No.: US12099536Application Date: 2008-04-08
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Publication No.: US07695306B2Publication Date: 2010-04-13
- Inventor: Shingo Chiba
- Applicant: Shingo Chiba
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Main IPC: H01R4/26
- IPC: H01R4/26

Abstract:
An electronic part-connecting structure is used in an electrical equipment including a housing, and bus bars which are mounted on the housing and have a plurality of pairs of opposed press-contacting blades to which electronic parts for circuit-protecting purposes are electrically connected by pressing. Positioning ribs are formed in proximity respectively to the press-contacting blades so as to position lead portions of the electronic parts at the respective press-contacting blades.
Public/Granted literature
- US20090251877A1 ELECTRONIC PART-CONNECTING STRUCTURE Public/Granted day:2009-10-08
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