Invention Grant
- Patent Title: Subassembly containing contact leads
- Patent Title (中): 包含接触引线的组件
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Application No.: US12427128Application Date: 2009-04-21
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Publication No.: US07695328B2Publication Date: 2010-04-13
- Inventor: Mark E. Martich
- Applicant: Mark E. Martich
- Applicant Address: US CT New London
- Assignee: Ortronics, Inc.
- Current Assignee: Ortronics, Inc.
- Current Assignee Address: US CT New London
- Agency: McCarter & English, LLP
- Main IPC: H01R4/48
- IPC: H01R4/48

Abstract:
A subassembly for incorporation within a communications connector jack includes a contact support member and a pair of electrical contacts mounted with respect thereto in side-by-side relation. The contact support member includes a proximal end portion and a body portion extending therefrom. The proximal end portion defines a planar rear face allowing the contact support member to be securely mounted in a cantilever fashion with respect to a corresponding planar mounting surface of a printed circuit board (PCB). An upper region of the body portion defines a sufficiently small profile as viewed along the longitudinal direction of extension of the contact support member from in front of its distal end to permit the incorporation of multiple respective instances of the contact support member within a common connector jack housing to define a desired contact layout geometry for interaction with a cooperative plug member.
Public/Granted literature
- US20090311916A1 SUBASSEMBLY CONTAINING CONTACT LEADS Public/Granted day:2009-12-17
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