Invention Grant
US07695570B2 Processing-subject cleaning method and apparatus, and device manufacturing method and device
失效
加工对象清洗方法和装置,以及装置的制造方法和装置
- Patent Title: Processing-subject cleaning method and apparatus, and device manufacturing method and device
- Patent Title (中): 加工对象清洗方法和装置,以及装置的制造方法和装置
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Application No.: US11368375Application Date: 2006-03-07
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Publication No.: US07695570B2Publication Date: 2010-04-13
- Inventor: Yoshiaki Mori
- Applicant: Yoshiaki Mori
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2002-73071 20020315
- Main IPC: B08B3/00
- IPC: B08B3/00 ; B08B5/04

Abstract:
The invention reduces the amounts of cleaning liquids and rinse liquid used, as well as the energy consumption. A cleaning head has a plurality of cleaning units and a drying unit. An organic substance cleaning portion of each cleaning unit blows a first cleaning agent selectively over a portion to be cleaned of a substrate, and sucks reaction products etc. through a first suction mouth. An inorganic substance cleaning portion blows a second cleaning agent over the portion to be cleaned of the substrate from which organic substance have been removed, and sucks reaction products etc. through a second suction mouth. A rinse portion blows pure water the portion of the substrate from which inorganic substance have been removed, and sucks its vapor through a third suction mouth. The drying unit dries the substrate by blowing out a heated gas from a hot wind blowing-out mouth. A light guide illuminates the portion to be cleaned of the substrate with ultraviolet light, and thereby decomposes residual organic substances.
Public/Granted literature
- US20060144428A1 Processing-subject cleaning method and apparatus, and device manufacturing method and device Public/Granted day:2006-07-06
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