Invention Grant
US07695667B2 Method and apparatus for separating a stamper from a patterned substrate
失效
用于将压模与图案化衬底分离的方法和装置
- Patent Title: Method and apparatus for separating a stamper from a patterned substrate
- Patent Title (中): 用于将压模与图案化衬底分离的方法和装置
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Application No.: US11365021Application Date: 2006-03-01
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Publication No.: US07695667B2Publication Date: 2010-04-13
- Inventor: Margaret Evans Best , Tsai-Wei Wu
- Applicant: Margaret Evans Best , Tsai-Wei Wu
- Applicant Address: NL Amsterdam
- Assignee: Hitachi Global Storage Technologies Netherlands B.V.
- Current Assignee: Hitachi Global Storage Technologies Netherlands B.V.
- Current Assignee Address: NL Amsterdam
- Agency: Kunzler Needham Massey & Thorpe
- Main IPC: B28B7/12
- IPC: B28B7/12

Abstract:
A method and apparatus are disclosed for separating a stamper from a patterned substrate. The method includes providing a substrate having a top and a bottom with an opening therein, providing a support mechanism configured to retain the substrate, providing a stamper having a formed pattern and configured to come in contact with the top of the substrate, wherein a chamber is formed within the opening of the substrate when the stamper is in contact with the substrate, providing a channel directed toward the chamber to introduce pressurized air into the chamber, and directing pressured air through the channel to the chamber to initiate separation of the stamper from the substrate. In certain embodiments, the pressurized air may be directed toward an opening in the substrate, such as a central ID hole in a disk. The disk may be incorporated within a storage device as pattered magnetic media.
Public/Granted literature
- US20070205524A1 Method and apparatus for separating a stamper from a patterned substrate Public/Granted day:2007-09-06
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