Invention Grant
US07695670B2 In-die cover forming method and method for manufacturing product integrated with cover
有权
模具盖成型方法和制造与盖子整合的产品的方法
- Patent Title: In-die cover forming method and method for manufacturing product integrated with cover
- Patent Title (中): 模具盖成型方法和制造与盖子整合的产品的方法
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Application No.: US11492228Application Date: 2006-07-25
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Publication No.: US07695670B2Publication Date: 2010-04-13
- Inventor: Kenichi Furuta , Tokimasa Ito , Hiroshi Mukai , Kazumichi Shigeno
- Applicant: Kenichi Furuta , Tokimasa Ito , Hiroshi Mukai , Kazumichi Shigeno
- Applicant Address: JP Aichi-pref
- Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee Address: JP Aichi-pref
- Agency: Posz Law Group, PLC
- Priority: JP2005-217938 20050727
- Main IPC: B29C51/10
- IPC: B29C51/10

Abstract:
An in-die cover forming method for integrally forming a cover member with a surface of a base member in a die is provided. The die including an upper die half and a lower die half. The upper die halves are movable relative to each other. The base member is set on the lower die half such that its back is opposed to the lower die half. Using position determining mechanisms located between the lower die half and the back of the base member, the position of the surface of the base member in relation to the lower die half in the die moving direction is determined. The cover member is placed between the base member and the upper die half. The cover member is integrated with the surface of the base member by closing the upper die half with respect to the lower die half while pressing the cover member against the base member through vacuuming.
Public/Granted literature
- US20070075464A1 In-die cover forming method and method for manufacturing product integrated with cover Public/Granted day:2007-04-05
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