Invention Grant
- Patent Title: Post positioning for interdigital bonded composite
- Patent Title (中): 叉指复合材料的后定位
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Application No.: US11781849Application Date: 2007-07-23
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Publication No.: US07695784B2Publication Date: 2010-04-13
- Inventor: Jay A. Williams , Jonathan M. Cannata , Ruibin Liu , K. Kirk Shung
- Applicant: Jay A. Williams , Jonathan M. Cannata , Ruibin Liu , K. Kirk Shung
- Applicant Address: US CA Los Angeles
- Assignee: University of Southern California
- Current Assignee: University of Southern California
- Current Assignee Address: US CA Los Angeles
- Agency: McDermott Will & Emery LLP
- Main IPC: F16B11/00
- IPC: F16B11/00 ; B23P19/04 ; B23Q3/00

Abstract:
Methods and systems are described for making posts and kerfs in an interdigital bonded composite. The desired alignment criteria for a plurality of posts and kerfs in a pair of slabs are determined, as well as the desired widths W of the posts and the desired widths K of the kerfs. The posts in the first slab are configured to be received into corresponding kerfs in the second slab, and vice versa, so that the pair of slabs can be interdigitated to generate a composite. At least one of an alignment post and an alignment kerf are created, in at least one of the slabs. The alignment posts and the alignment kerf are configured to allow the plurality of posts and kerfs to be correctly positioned and aligned, in accordance with the desired alignment criteria.
Public/Granted literature
- US20080020153A1 Post Positioning For Interdigital Bonded Composite Public/Granted day:2008-01-24
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