Invention Grant
- Patent Title: Moulding composition for producing bipolar plates
- Patent Title (中): 用于制造双极板的成型组合物
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Application No.: US11710427Application Date: 2007-02-26
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Publication No.: US07695806B2Publication Date: 2010-04-13
- Inventor: Martin Spitzer , Philip David Willis , Gunnar Reitmajer
- Applicant: Martin Spitzer , Philip David Willis , Gunnar Reitmajer
- Applicant Address: CH Basel
- Assignee: Duresco GmbH
- Current Assignee: Duresco GmbH
- Current Assignee Address: CH Basel
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: CH881/01 20010514
- Main IPC: B32B27/26
- IPC: B32B27/26 ; B32B27/20 ; B32B27/38 ; B29C43/00 ; B29C45/00 ; B29C67/00 ; C08K3/04 ; C08L63/00 ; B29C35/00
Abstract:
Compositions comprising (a) an epoxy resin, (b) a hardener for the epoxy resin, (c) a product of the reaction of a microgel containing carboxylic acid groups and a nitrogen-containing base, and (d) an electrically conducting filler combination comprising, based on the total amount of filler, at least 75% by weight of graphite, are particularly suitable for producing biopolar plates.
Public/Granted literature
- US20070185244A1 Moulding composition for producing bipolar plates Public/Granted day:2007-08-09
Information query
