Invention Grant
- Patent Title: Photosensitive composition, pattern forming method using the photosensitive composition and compound for use in the photosensitive composition
- Patent Title (中): 感光组合物，使用光敏组合物的图案形成方法和用于感光组合物中的化合物
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Application No.: US11471713Application Date: 2006-06-21
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Publication No.: US07695891B2Publication Date: 2010-04-13
- Inventor: Kenji Wada
- Applicant: Kenji Wada
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPP.2005-180980 20050621
- Main IPC: G03F7/004
- IPC: G03F7/004 ; C07C309/00
Abstract:
A photosensitive composition comprising a compound capable of generating a compound having a specific structure upon irradiation with actinic rays or radiation; a pattern forming method using the photosensitive composition; a compound having a specific structure; and a compound capable of generating a compound having a specific structure upon irradiation with actinic rays or radiation.
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