Invention Grant
- Patent Title: Light exposure apparatus and manufacturing method of semiconductor device using the same
- Patent Title (中): 曝光装置及使用其的半导体装置的制造方法
-
Application No.: US10582616Application Date: 2005-12-21
-
Publication No.: US07695985B2Publication Date: 2010-04-13
- Inventor: Koichiro Tanaka , Yoshiaki Yamamoto
- Applicant: Koichiro Tanaka , Yoshiaki Yamamoto
- Applicant Address: unknown Atsugi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd
- Current Assignee Address: unknown Atsugi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2004-375080 20041224
- International Application: PCT/JP2005/024018 WO 20051221
- International Announcement: WO2006/075525 WO 20060720
- Main IPC: H01L21/66
- IPC: H01L21/66

Abstract:
When annealing of a semiconductor film is conducted using a plurality of lasers, each of the distances between laser irradiation regions is different. When a lithography step is conducted in accordance with a marker which is formed over a substrate in advance after the step, light-exposure is not correctly conducted to a portion crystallized by laser. By using a laser irradiation region obtained on a laser irradiation step as a marker, light-exposure is conducted by making a light-exposure position of a stepper coincide with a large grain size region in the laser irradiation region. A large grain size region and a poorly crystalline region are detected by utilizing a thing that scattering intensity of light is different between the large grain size region and the poorly crystalline region, thereby determining a light-exposure position.
Public/Granted literature
- US20080151262A1 Light Exposure Apparatus and Manufacturing Method of Semiconductor Device Using the Same Public/Granted day:2008-06-26
Information query
IPC分类: