Invention Grant
- Patent Title: Method for manufacturing GaN semiconductor light-emitting element
- Patent Title (中): 制造GaN半导体发光元件的方法
-
Application No.: US11463233Application Date: 2006-08-08
-
Publication No.: US07695991B2Publication Date: 2010-04-13
- Inventor: Hiroyuki Okuyama , Goshi Biwa
- Applicant: Hiroyuki Okuyama , Goshi Biwa
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: K&L Gates LLP
- Priority: JPP2005-230415 20050809
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method for manufacturing a GaN semiconductor light-emitting element is provided. The method for manufacturing a GaN semiconductor light-emitting element includes forming, by crystal growth, a first GaN compound semiconductor layer of a first conductivity type, the top face of which corresponds to the A plane, an active layer composed of InxGa(1−x)N, the top face of which corresponds to the A plane, and a second GaN compound semiconductor layer of a second conductivity type, the top face of which corresponds to the A plane, in that order on a base which is a nonpolar plane, wherein the active layer is formed at a crystal growth rate of 0.3 nm/sec or more.
Public/Granted literature
- US20070037308A1 METHOD FOR MANUFACTURING GaN SEMICONDUCTOR LIGHT-EMITTING ELEMENT Public/Granted day:2007-02-15
Information query
IPC分类: