Invention Grant
- Patent Title: Low defect Si:C layer with retrograde carbon profile
- Patent Title (中): 低缺陷Si:C层具有逆行碳分布
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Application No.: US11565793Application Date: 2006-12-01
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Publication No.: US07696000B2Publication Date: 2010-04-13
- Inventor: Yaocheng Liu , Subramanian S. Iyer , Jinghong Li
- Applicant: Yaocheng Liu , Subramanian S. Iyer , Jinghong Li
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent H. Daniel Schnurmann
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
Formation of carbon-substituted single crystal silicon layer is prone to generation of large number of defects especially at high carbon concentration. The present invention provides structures and methods for providing low defect carbon-substituted single crystal silicon layer even for high concentration of carbon in the silicon. According to the present invention, the active retrograde profile in the carbon implantation reduces the defect density in the carbon-substituted single crystal silicon layer obtained after a solid phase epitaxy. This enables the formation of semiconductor structures with compressive stress and low defect density. When applied to semiconductor transistors, the present invention enables N-type field effect transistors with enhanced electron mobility through the tensile stress that is present into the channel.
Public/Granted literature
- US20080128806A1 LOW DEFECT SI:C LAYER WITH RETROGRADE CARBON PROFILE Public/Granted day:2008-06-05
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