A method for mounting semiconductor chips on a substrate using flip-chip technology and a corresponding assembly are provided, which method includes the steps of: a) providing a semiconductor chip having a component region including components and an edge region, a mounting region containing a plurality of bonding pads being situated in the edge region; b) providing a substrate having a surface including a plurality of lands; c) applying soldering material to the bonding pads and/or to the lands; d) positioning the semiconductor chip on the substrate; and e) melting the soldering material by a soldering process in such a way that the mounting region of the semiconductor chip is moved towards the substrate due to the surface tension of the melting soldering material, and the component region is lifted away from the substrate by the resulting rotation around an axis of rotation or a pivot between the two regions.