Invention Grant
- Patent Title: Microelectronic component assemblies with recessed wire bonds and methods of making same
- Patent Title (中): 具有凹陷线接合的微电子元件组件及其制造方法
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Application No.: US12046614Application Date: 2008-03-12
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Publication No.: US07696003B2Publication Date: 2010-04-13
- Inventor: Eric Swee Seng Tan , Edmund Kwok Chung Low
- Applicant: Eric Swee Seng Tan , Edmund Kwok Chung Low
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Priority: SG200404238 20040723
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/66 ; H01L23/28 ; H01L23/29
Abstract:
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, a substrate, and at least one bond wire. The substrate has a reduced-thickness base adjacent terminals of the microelectronic component and a body having a contact surface spaced farther from the microelectronic component than a bond pad surface of the base. The bond wire couples the microelectronic component to a bond pad carried by the bond pad surface and has a maximum height outwardly from the microelectronic component that is no greater than the height of the contact surface from the microelectronic component.
Public/Granted literature
- US20080164591A1 MICROELECTRONIC COMPONENT ASSEMBLIES WITH RECESSED WIRE BONDS AND METHODS OF MAKING SAME Public/Granted day:2008-07-10
Information query
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