Invention Grant
- Patent Title: Connecting microsized devices using ablative films
- Patent Title (中): 使用烧蚀膜连接微型器件
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Application No.: US11737187Application Date: 2007-04-19
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Publication No.: US07696013B2Publication Date: 2010-04-13
- Inventor: M. Zaki Ali , A. Peter Stolt , Gilbert A. Hawkins , Thomas M. Stephany
- Applicant: M. Zaki Ali , A. Peter Stolt , Gilbert A. Hawkins , Thomas M. Stephany
- Applicant Address: US NY Rochester
- Assignee: Eastman Kodak Company
- Current Assignee: Eastman Kodak Company
- Current Assignee Address: US NY Rochester
- Agent Peyton C. Watkins
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of providing connectivity to a microsized device, the method includes the steps of providing an ablative base material having at least a top surface; providing a die having a first and second surface and having bonding pads at least upon the first surface; placing the die with the at least first surface of the die contacting the at least first surface of the ablative base material; and ablating a channel in the ablative material proximate to the die.
Public/Granted literature
- US20080258313A1 CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS Public/Granted day:2008-10-23
Information query
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