Invention Grant
- Patent Title: Method of forming a stack of heat generating integrated circuit chips with intervening cooling integrated circuit chips
- Patent Title (中): 用中间冷却集成电路芯片形成一堆发热集成电路芯片的方法
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Application No.: US11448232Application Date: 2006-06-07
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Publication No.: US07696015B2Publication Date: 2010-04-13
- Inventor: Sarah E. Kim , R. Scott List , James G. Maveety , Alan M. Myers , Quat T. Vu
- Applicant: Sarah E. Kim , R. Scott List , James G. Maveety , Alan M. Myers , Quat T. Vu
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/48 ; H01L21/44
Abstract:
A stack of heat generating integrated circuit chips may be provided with intervening cooling integrated circuit chips. The cooling integrated circuit chips may include microchannels for the flow of the cooling fluid. The cooling fluid may be pumped using the integrated electroosmotic pumps. Removal of cooling fluid gases may be accomplished using integrated re-combiners in some embodiments.
Public/Granted literature
- US20060226541A1 Electroosmotic pumps using porous frits for cooling integrated circuit stacks Public/Granted day:2006-10-12
Information query
IPC分类:
