Methods of base formation in a BiCOMS process

Invention Grant

US07696034B2 Methods of base formation in a BiCOMS process 失效

Title translation: BiCOMS工艺中碱形成的方法

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Patent Title: Methods of base formation in a BiCOMS process
Patent Title (中): BiCOMS工艺中碱形成的方法
Application No.: US12128077

Application Date: 2008-05-28
Publication No.: US07696034B2

Publication Date: 2010-04-13
Inventor: Peter J. Geiss , Marwan H. Khater , Qizhi Liu , Randy W. Mann , Robert J. Purtell , Beth Ann Rainey , Jae-Sung Rieh , Andreas D. Stricker
Applicant: Peter J. Geiss , Marwan H. Khater , Qizhi Liu , Randy W. Mann , Robert J. Purtell , Beth Ann Rainey , Jae-Sung Rieh , Andreas D. Stricker
Applicant Address: US NY Armonk
Assignee: International Business Machines Corporation
Current Assignee: International Business Machines Corporation
Current Assignee Address: US NY Armonk
Agency: Scully, Scott, Murphy & Presser, P.C.
Agent W. Riyon Harding
Main IPC: H01L21/8238
IPC: H01L21/8238

Methods of base formation in a BiCOMS process

Abstract:

Methods for fabricating a heterojunction bipolar transistor having a raised extrinsic base is provided in which the base resistance is reduced by forming a silicide atop the raised extrinsic base that extends to the emitter region in a self-aligned manner. The silicide formation is incorporated into a BiCMOS process flow after the raised extrinsic base has been formed. The present invention also provides a heterojunction bipolar transistor having a raised extrinsic base and a silicide located atop the raised extrinsic base. The silicide atop the raised extrinsic base extends to the emitter in a self-aligned manner. The emitter is separated from the silicide by a spacer.

Abstract(Chinese):

提供了制造具有凸起非本征基极的异质结双极晶体管的方法，其中通过在以自对准方式延伸到发射极区域的凸起的外部基极之上形成硅化物来降低基极电阻。在形成凸起的外基之后，将硅化物形成结合到BiCMOS工艺流程中。本发明还提供了一种异质结双极晶体管，其具有凸起的外部基极和位于凸起外部基极顶部的硅化物。凸起的外基极上面的硅化物以自对准的方式延伸到发射极。发射极通过间隔物与硅化物分离。

Public/Granted literature

US20080268604A1 METHODS OF BASE FORMATION IN A BiCMOS PROCESS Public/Granted day:2008-10-30

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232	......场效应工艺
H01L21/8234	.......MIS工艺
H01L21/8238	........互补场效应晶体管，例如CMOS