Invention Grant
US07696051B2 Method of fabricating a MOSFET having doped epitaxially grown source/drain region on recessed substrate 失效
制造在凹陷衬底上具有掺杂的外延生长源/漏区的MOSFET的方法

Method of fabricating a MOSFET having doped epitaxially grown source/drain region on recessed substrate
Abstract:
A MOSFET includes a semiconductor substrate with a first region having a relatively thick first thickness and a second region having a relatively thin second thickness; a gate insulating layer pattern formed on the first region of the semiconductor substrate; a gate conductive layer pattern formed on the gate insulating layer pattern; an epitaxial layer formed on the second region of the semiconductor substrate so as to have a predetermined thickness; spacers formed on sidewalls of the gate conductive layer pattern and part of the surface of the epitaxial layer; a lightly-doped first impurity region formed in the semiconductor substrate disposed below the spacers and in the epitaxial layer; and a heavily-doped second impurity region formed in a portion of the semiconductor substrate, exposed by the spacers.
Public/Granted literature
Information query
Patent Agency Ranking
0/0