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US07696053B2 Implantation method for doping semiconductor substrate 失效
掺杂半导体衬底的植入方法

Implantation method for doping semiconductor substrate
Abstract:
Embodiments relate to a semiconductor device that may include a gate stack formed on an upper portion of an active region in a semiconductor substrate, the gate stack including a gate insulating layer and a gate, a first shallow impurity region formed on both sides of the gate in the semiconductor substrate, a gate spacer layer formed on one side of the gate stack, and a second deep impurity region formed in the semiconductor substrate by using the gate spacer layer as a mask, in which the gate is formed by implanting p-type ions.
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