Invention Grant
- Patent Title: Implantation method for doping semiconductor substrate
- Patent Title (中): 掺杂半导体衬底的植入方法
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Application No.: US11614586Application Date: 2006-12-21
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Publication No.: US07696053B2Publication Date: 2010-04-13
- Inventor: Tae Woo Kim
- Applicant: Tae Woo Kim
- Applicant Address: KR Seoul
- Assignee: Dongbu HiTek Co., Ltd.
- Current Assignee: Dongbu HiTek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Sherr & Vaughn, PLLC
- Priority: KR10-2005-0130908 20051227
- Main IPC: H01L21/426
- IPC: H01L21/426

Abstract:
Embodiments relate to a semiconductor device that may include a gate stack formed on an upper portion of an active region in a semiconductor substrate, the gate stack including a gate insulating layer and a gate, a first shallow impurity region formed on both sides of the gate in the semiconductor substrate, a gate spacer layer formed on one side of the gate stack, and a second deep impurity region formed in the semiconductor substrate by using the gate spacer layer as a mask, in which the gate is formed by implanting p-type ions.
Public/Granted literature
- US20070145432A1 SEMICONDUCTOR DEVICE Public/Granted day:2007-06-28
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