Invention Grant
- Patent Title: Semiconductor device and method for manufacturing same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11902911Application Date: 2007-09-26
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Publication No.: US07696061B2Publication Date: 2010-04-13
- Inventor: Hitoshi Ninomiya
- Applicant: Hitoshi Ninomiya
- Applicant Address: JP Kawasaki, Kanagawa
- Assignee: NEC Electronics Corporation
- Current Assignee: NEC Electronics Corporation
- Current Assignee Address: JP Kawasaki, Kanagawa
- Agency: McGinn IP Law Group, LLC
- Priority: JP2004-138357 20040507
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A semiconductor device comprises a drift region of a first conduction type, a base region of a second conduction type, a source region of the first conduction type, a contact hole, a column region of the second conduction type, a plug and wiring. The drift region formed on a semiconductor substrate of the first conduction type. The base region of a second is formed in a prescribed region of the surface of the drift region. The source region is formed in a prescribed region of the surface of the base region. The contact hole extends from the source region surface side to the base region. The column region is formed in the drift region below the contact hole. The plug comprises a first conductive material and fills the contact hole. The wiring comprises a second conductive material and is electrically connected to the plug.
Public/Granted literature
- US20080032477A1 Semiconductor device and method for manufacturing same Public/Granted day:2008-02-07
Information query
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