Invention Grant
US07696088B2 Manufacturing methods of metal wire, electrode and TFT array substrate
有权
金属线，电极和TFT阵列基板的制造方法
- Patent Title: Manufacturing methods of metal wire, electrode and TFT array substrate
- Patent Title (中): 金属线，电极和TFT阵列基板的制造方法
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Application No.: US11958634Application Date: 2007-12-18
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Publication No.: US07696088B2Publication Date: 2010-04-13
- Inventor: Chunping Long , Xinxin Li
- Applicant: Chunping Long , Xinxin Li
- Applicant Address: CN Beijing
- Assignee: Beijing BOE Optoelectronics Technology Co., Ltd.
- Current Assignee: Beijing BOE Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Hasse & Nesbitt LLC
- Agent Daniel F. Nesbitt
- Priority: CN200710063235 20070104
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A method of forming a gate line and gate electrode and a method of manufacturing a TFT array substrate. The metal gate line and gate electrode can be formed by: providing a substrate, forming a photoresist layer on the substrate, a photoresist pattern being formed complementary with that of the gate line and gate electrode, forming a metal Cu thin film or a composite thin film comprising a metal Cu thin film on the substrate, and removing the photoresist pattern and the metal Cu thin film or composite thin film comprising the metal Cu thin film formed thereon from the substrate.
Public/Granted literature
- US20080166838A1 MANUFACTURING METHODS OF METAL WIRE, ELECTRODE AND TFT ARRAY SUBSTRATE Public/Granted day:2008-07-10
Information query
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