Invention Grant
- Patent Title: Low-density cleaning substrate
- Patent Title (中): 低密度清洗基材
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Application No.: US11361105Application Date: 2006-02-24
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Publication No.: US07696109B2Publication Date: 2010-04-13
- Inventor: William Ouellette , Nikhil Dani , Richard Suk
- Applicant: William Ouellette , Nikhil Dani , Richard Suk
- Applicant Address: US CA Oakland
- Assignee: The Clorox Company
- Current Assignee: The Clorox Company
- Current Assignee Address: US CA Oakland
- Agent Erin Collins; Thomas Feix
- Main IPC: B23B27/12
- IPC: B23B27/12 ; D04H1/56

Abstract:
The present invention is directed to a low-density substrate, which has an optimized pore volume distribution. The optimized pore volume distribution allows the substrate to hold at least 50 percent of its cumulative volume within pores with a radius size of about 110 to 250 microns. The optimized pore volume distribution can also be characterized by having a dry fibrous web that absorbs less than 20 percent of the cumulative volume of the fibrous web at a pore radius of 75 microns. The optimized pore volume distribution of the substrate enables it to controllably release a fluid composition effectively onto a surface. The basis weight of the substrate is about 80 to 20 gsm and the density of the substrate is below 0.1 g/cc. The substrate may be a pre-loaded wipe, which is either moistened by a consumer prior to use or moistened prior to packaging. The composition loaded onto the substrate may contain dry and/or liquid compositions preferably for cleaning hard or soft surfaces.
Public/Granted literature
- US20070202766A1 Low-density cleaning substrate Public/Granted day:2007-08-30
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