Invention Grant
US07696286B2 Semiconductor encapsulant of epoxy resin, polyphenolic compound, filler and accelerator
失效
环氧树脂的半导体密封剂，多酚类化合物，填料和促进剂
- Patent Title: Semiconductor encapsulant of epoxy resin, polyphenolic compound, filler and accelerator
- Patent Title (中): 环氧树脂的半导体密封剂，多酚类化合物，填料和促进剂
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Application No.: US11729656Application Date: 2007-03-29
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Publication No.: US07696286B2Publication Date: 2010-04-13
- Inventor: Masashi Endo , Hirofumi Kuroda
- Applicant: Masashi Endo , Hirofumi Kuroda
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Bakelite Company, Ltd.
- Current Assignee: Sumitomo Bakelite Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Smith, Gambrell & Russell, LLP
- Priority: JP2006-100287 20060331; JP2007-004252 20070112
- Main IPC: C08K3/04
- IPC: C08K3/04 ; C08K3/36 ; C08L63/04 ; H01L23/29
Abstract:
A resin composition for semiconductor encapsulation contains an epoxy resin (A); a phenolic compound (B) containing two or more phenolic hydroxyl groups; an inorganic filler (C); and a curing accelerator (D). The epoxy resin (A) contains an epoxy resin (a1) represented by the formula (1) wherein Ar is a C6-C20 aryl group, R1 is a C1-C6 hydrocarbon group, R2 is a C1-C4 hydrocarbon group, W1 is oxygen or sulfur, RO is a C1-C6 hydrocarbon group, a=0-10, g=0-3, 0
Public/Granted literature
- US20070232728A1 Resin composition for semiconductor encapsulation and semiconductor device Public/Granted day:2007-10-04
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