Invention Grant
- Patent Title: Electric-field-enhancement structures including dielectric particles, apparatus including same, and methods of use
- Patent Title (中): 包括电介质颗粒的电场增强结构,包括其的设备和使用方法
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Application No.: US11724409Application Date: 2007-03-14
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Publication No.: US07696477B2Publication Date: 2010-04-13
- Inventor: Mihail Sigalas , R. Stanley Williams , David A. Fattal , Shih-Yuan Wang , Raymond G. Beausoleil
- Applicant: Mihail Sigalas , R. Stanley Williams , David A. Fattal , Shih-Yuan Wang , Raymond G. Beausoleil
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: G01N23/00
- IPC: G01N23/00

Abstract:
In one aspect of the present invention, an electric-field-enhancement structure is disclosed. The electric-field-enhancement structure includes a substrate and an ordered arrangement of dielectric particles having at least two adjacent dielectric particles spaced from each other a controlled distance. The controlled distance is selected so that when a resonance mode is excited in each of the at least two adjacent dielectric particles responsive to excitation electromagnetic radiation, each of the resonance modes interacts with each other to result in an enhanced electric field between the at least two adjacent dielectric particles. Other aspects of the present invention are electric-field-enhancement apparatuses that utilize the described electric-field-enhancement structures, and methods of enhancing an electric field between adjacent dielectric particles.
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